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環氧灌封膠



應用方法?Handling?instruction

為了確保被灌封的電子設備的持久性能.灌封前應該徹底清理元器件表面的灰塵.濕氣.油污.以免引起電性能失效以及與被灌封部位低的附著力.混合物應該進行真空脫泡.以排除所有的空氣后灌封.

Electronic?devices?must?be?cleaned?so?as?to?avoid?the?failure?of?electrical?property?and?adhesive?force?due?to?the?dust?and?oil?contamination?on?the?surface.?The?mixture?should?be?degassed?by?vacuum?action?then?to?encapsulate.



特點與優勢Features?and?Benefits

雙組份室溫或加熱固化的環氧灌封膠.導熱性能由低到高可選擇.絕緣密封性強.高粘度產品適合導熱粘接,低粘度產品適合導熱灌封.

Thermal?conductive?adhesives?have?been?high?adhesive?strength?when?the?units?can?be?fix?after?fast?full-curded,and?perfest?thermal?conductivity?and?electrical?insulation.



應用領域?Applications

戶外LED散熱器件的灌封與粘接

LED?heat?sink?device?outdoor

溫度傳感器的灌封

Temperature?transmitter

功率管與原器件的灌封與熱傳導

Power?tube?and?electronic?devices?







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